接觸電阻
100 mΩ 最大值
絕緣電阻
100MΩ min
耐電壓
AC 250 V and induction current 1 mA shall be applied for test between terminals and between terminals and frame for one minute
端子強度
A static force of 300 g being applied in one direction on the tip of the terminal for l minute.
動作力
160gf / 250gf
可焊性試驗
The tip of the terminals shall be dipped 2 mm in the solder bath within temperature of 235±5℃for 3 seconds.
耐焊性試驗
Manual soldering temperature 350±5℃, soldering time 3±0.5 seconds,however excessive pressure shall not be applied to the terminal.
回流焊接熱試驗
預熱:銅箔表面溫度應在120秒內達到180℃。然後,將PCB裝入設備。
耐濕試驗
40±2℃ 90-95% RH for 96 hours.test after keeping in normal condition for 30 minutes.
耐冷試驗
At -40±3℃ for 96 hours, test after keeping in normal condition for 30minutes
耐熱試驗
80±2℃ for 96 hours,test after keeping in normal condition for 30 minutes.
波峰焊試驗
密封包裝
在密封包裝狀態下,儲存溫度不超過 30℃,相對濕度為 75% RH。在無陽光直射且無腐蝕性氣體的環境中,儲存時間應為三個月,但最長不得超過六個月。.
未附密封套件
在未拆封的狀態下,儲存溫度不得超過 30℃,相對濕度為 75% RH。在無陽光直射且無腐蝕性氣體的環境中,儲存時間不應超過 168 小時。存放此類貨物時,請勿過度堆疊或過度堆放,以免造成損壞。.
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