Contact resistance
100 mΩ max
Insulation resistance
100 mΩ min
Voltage proof
AC 250 V and induction current 1 mA shall be applied for test between terminals and between terminals and frame for one minute.
Terminal strength
A static force of 300 g being applied in one direction on the tip of the terminal for 1 minute.
Operating force
Soldering test
The tip of the terminals shall be dipped 2 mm in the solder bath within temperature of 235±5℃ for 3 seconds.
Soldering resistant test
Manual soldering temperature 350±5℃, soldering time 3±0.5 seconds, however excessive pressure shall not be applied to the terminal.
Reflow soldering heat test
Preheat: The temperature of the copper foil surface should reach 180°C within 120 seconds. Then, load the PCB into the equipment.
Moisture resistant test
40±2℃ 90-95% RH for 96 hours. Test after keeping in normal condition for 30 minutes.
Cold resistant test
At -40±3℃ for 96 hours, test after keeping in normal condition for 30minutes.
Heat resistant test
80±2℃ for 96 hours, test after keeping in normal condition for 30 minutes.
Wave soldering test
When applying wave soldering, the peak temperature of the wave oven should be set to 260℃ max.
Under Sealing Pack
Under sealing pack condition, stored temperature doesn't exceed 30℃ and relative humidity is 75% RH. In the environment of no sunshine direct and no corrosive gas, the stored time ought to be three months but within six months at most.
Without Sealing Pack
Without sealing pack condition, stored temperature doesn't exceed 30℃ and relative humidity is 75% RH. In the environment of no sunshine direct and no corrosive gas, the stored time shouldn't exceed 168H. Don't excessive overlap or overstocking when keeping these goods, in case of damage.
Submit your required pin configurations, target quantities, or CAD requests. Our application engineers will confirm lead times and pricing within 24 hours.
